|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Influences of Wettability and Volume of Sn-based Solder Alloys on Self-Alignment Accuracy
||Hwan-Pil Park, Gwancheol Seo, Young-Ho Kim
|On-Site Speaker (Planned)
Solder self-alignment is a typical and important phenomenon enabling cost-effective device packaging requiring accurate positioning. In this study, we discussed the wettability of Sn-based solder alloys on different substrate and their critical solder volume affecting self-alignment accuracy. To investigate the influence of solder wetting and volume on self-alignment accuracy, the contact angle of SAC305 and Sn3.5Ag solder on two different commercial surface finish substrates (ENEPIG and OSP) was measured and solder volume was controlled by varying their bonding height from 10 to 100 μm, respectively. By using a transparency glass chip, the measurement of exact location was analyzed by the high resolution optical microscopy and scanning electron microscopy. The alignment accuracy depends on solder wettability and volume. Controlling solder wettability and volume, alignment of less than 1 μm can be obtained. This study will contribute to reduce the die position error in flip-chip technologies and fan-out package manufacturing approaches.
||Planned: Supplemental Proceedings volume