| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Interfacial Reactions of Cu/Sn3.5Ag/Au Solder Joint under Electromigration |
| Author(s) |
Tsung-Chieh Chiu, Kwang-Lung Lin |
| On-Site Speaker (Planned) |
Tsung-Chieh Chiu |
| Abstract Scope |
In this study, a lead free Cu/Sn3.5Ag/Au solder joint under electromigration of 2.56×103 A/cm2 at 100℃ with various times was investigated. After 480 h of current stressing, the morphology of cathodic Cu electrode became rough which is due to the migration of Cu toward the anode side. The AuSn4 in the solder matrix near the Cu electrode tended to dissolve and released Au in the interfacial Cu6Sn5 to form (Cu,Au)6Sn5. The migration of Sn to the anode resulted in the formation of crack at the (Cu,Au)6Sn5/solder interface. As the Cu at the anode side, the thickness of IMC formed under electromigration is greater than that under isothermal aging. At the Au electrode, four types of IMC including AuSn4, AuSn2, AuSn and Au5Sn were sequentially formed at the interface regardless of the direction of electron flow under electromigration. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |