About this Abstract |
Meeting |
2020 TMS Annual Meeting & Exhibition
|
Symposium
|
Recent Developments in Biological, Structural and Functional Thin Films and Coatings
|
Presentation Title |
Influence of Interface Chemistry on the Adhesion between Metallic Films and Polymer Substrates |
Author(s) |
Megan J. Cordill, Marian Kennedy |
On-Site Speaker (Planned) |
Megan J. Cordill |
Abstract Scope |
Flexible and foldable electronics are becoming more visible for consumers. These devices are often manufactured with metallic films or islands deposited onto compliant polymer substrates. More research is needed to fully understand how to control the metal-polymer interface of the vital interconnecting metal lines found in flexible electronics to improve reliability. While the methods to quantify the interface adhesion are available, a direct comparison of the adhesion of a standard metallic films on different substrates performed to correlate interfacial chemistry and adhesion. Our results demonstrate that a Ti adhesion interlay did not improve the adhesion of Ag films to polyimide (PI) or polyethylene naphthalene (PEN). In addition, the Ag-PI interface had a higher adhesion energy relative to the Ag-PEN interface due to the unique chemical interface which forms between film and substrate. |
Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |