|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Ultrafine-grained Materials X
||Fracture Behavior of Bulk Cu with Nanoscale Twins
||S.S. Luo, Z.S. You, Lei Lu
|On-Site Speaker (Planned)
Comparing with the extensive studies on the mechanical properties and deformation mechanism, reliable fracture mechanics evolution of nanostructured materials is still rather limited so far. This scarcity stems mainly from the fact that current existing techniques for preparing nanostructured materials cannot deliver sufficient specimen volume required for conventional fracture tests. In this study, a contactless video crack opening displacement (VCOD) gauging system based on digital image correlation technique was established to measure the load-line displacement of miniaturized nanostructured samples accurately. Sample thickness effect on fracture toughness of columnar-grained Cu with preferentially oriented nanoscale twins was investigated systematically. Below a critical thickness, plane stress state prevailed ahead of the crack tip and the provisional fracture toughness JC increased with increasing thickness until reaching a peak value. Further increase in thickness caused the JC to decrease until acquiring an intrinsic specimen-independent fracture toughness when the crack-front was under plane strain condition.
||Planned: Supplemental Proceedings volume