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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Recent Advances in Functional Materials for Printed, Flexible and Wearable Electronics
Presentation Title Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
Author(s) Tolga Aytug, M. Rager, F. G, Brown, W. H. Higgins, H. Wang, Z. Hood, C. M. Rouleau, Pooran Joshi
On-Site Speaker (Planned) Tolga Aytug
Abstract Scope We present photo-thermochemical processing of inkjet-printed CuO nanoparticles for efficient fabrication of Cu electrodes as a cost-effective alternative to complex lithographic techniques for large-scale fabrication of flexible electronic devices. Pulse-thermal processing (PTP) technique was used to reduce CuO to Cu and subsequently sinter the Cu nanoparticles on flexible, silica-coated PET substrates. The effects of PTP on print conductivity and mechanical stability were studied as a function of pulse intensity, number of pulses and pulse duration. Supercapacitors combining the synergic advantages of improved electrochemical performance, flexibility and transparency hold great promise in multifunctional devices. We demonstrate a simple yet scalable fabrication approach to produce optically transparent, mechanically flexible all-solid-state supercapacitors comprised of 2D multi-layered reduced graphene oxide electrodes on ITO-coated PET substrates stacked with a polymer gel electrolyte. Present devices demonstrated a high area specific capacitance and stable cycling along with excellent flexibility as a function of bending angle and cycles.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

3-D Printed Polymer-based Gas Sensors
3D Electronics and Sensor Circuits by Combining Conventional PCB Technology with Low Temperature Embedding and Forming
3D Printed Anodes for Al-air Batteries
3D Printing of Metals and Metal Oxides from Solution for Energy and Biomedical Applications
3D Printing of Soft Ionic Actuators/Sensors for Soft Robotic Applications
Additive Manufacturing with Aerosol Jet: From Prototyping to Production
Challenges in Gravure and Direct-write Printing of Nano-colloidal Inks
Delaminated Inkjet Printed Lines with Improved Electro-mechanical Behavior
High Performance Sensors and Antennas by 2D and 3D Printing of Nanoparticles
Highly Stretchable Metallic Interconnects on Polymer Substrates: Architecture and Mechanisms
Hide details for [<a href="/PM/PM.nsf/ApprovedAbstracts/C0529C03377A93C285258193005AA23F?OpenDocument">Integrated and Flexible Integrated and Flexible Biosensors for Point-of-care Diagnostics
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Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
Microheater Array Powder Sintering: A New Process for Printed Electronics
Nondestructive Examination Study in P(VDF-TrFE) Filter System and PM2.5 Spatial Resolution Technology by Using Synchrotron Transmission X-ray Microscopy
Printable Functional Materials for Smart Fabrics
Recent Advancement on Printed, Stretchable, and Wearable Electronics in 2D Materials
Room-temperature Aerosol Deposition of PLZT Films on Polymer Substrates
Single-crystalline-like Semiconductor Films on Flexible Substrates: A Route towards Roll-to-roll Manufacturing of High-performance Electronic Devices
Stretchable Wirings Prepared with PU and Silver Flakes
Structural-resolved Study Of Piezoelectric Properties Of P(VDF-TrFE) Films
Textile-enabled Wearable Energy Storage Devices (invited)
Transparent Field Effect Biosensors Printed on Highly Curved Surfaces
Ultrafast Pulsed Light Sintering of Thermoelectric Nanoparticles

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