|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Recent Advances in Functional Materials for Printed, Flexible and Wearable Electronics
||Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
||Tolga Aytug, M. Rager, F. G, Brown, W. H. Higgins, H. Wang, Z. Hood, C. M. Rouleau, Pooran Joshi
|On-Site Speaker (Planned)
We present photo-thermochemical processing of inkjet-printed CuO nanoparticles for efficient fabrication of Cu electrodes as a cost-effective alternative to complex lithographic techniques for large-scale fabrication of flexible electronic devices. Pulse-thermal processing (PTP) technique was used to reduce CuO to Cu and subsequently sinter the Cu nanoparticles on flexible, silica-coated PET substrates. The effects of PTP on print conductivity and mechanical stability were studied as a function of pulse intensity, number of pulses and pulse duration. Supercapacitors combining the synergic advantages of improved electrochemical performance, flexibility and transparency hold great promise in multifunctional devices. We demonstrate a simple yet scalable fabrication approach to produce optically transparent, mechanically flexible all-solid-state supercapacitors comprised of 2D multi-layered reduced graphene oxide electrodes on ITO-coated PET substrates stacked with a polymer gel electrolyte. Present devices demonstrated a high area specific capacitance and stable cycling along with excellent flexibility as a function of bending angle and cycles.
||Planned: Supplemental Proceedings volume