|About this Abstract
||2013 TMS Annual Meeting & Exhibition
||2013 and Beyond: Flexible Electronics
||Shape Memory Polymer Substrates for Softening, 3D Neural Interfaces
||Taylor Ware, Dustin Simon, Walter Voit
|On-Site Speaker (Planned)
Silicon-based neural interfaces have been shown to have limited stability during chronic implantation. This general failure of electronic devices, usually within a year of implantation, has been partially attributed to the extreme mechanical and geometrical mismatch between the substrate and tissue. In this work a smart polymer capable of softening in response to physiological conditions, despite low water uptake, is developed. Substrates are designed to remain in the high modulus, glassy state during implantation and soften after implantation. The novel thiol-ene/acrylate substrate provides control of the glass transition temperature and modulus in physiological conditions. The shear modulus under simulated physiological conditions increases with diacrylate content from 6.5 to 30 MPa. A process is described that allows for the use of substrates in a planar state for processing and subsequent programming of a 3D shape. This allows for high-density electrode fabrication on substrates that conform to complex neural tissue after implantation.