|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Understand the Corrosion-induced Disappearance of Cu9Al4 from the Cu-Al Ball Bond Interface
||Yuelin Wu, Andre Lee
|On-Site Speaker (Planned)
Cu wire bonding between the integrated circuit and the metal lead frame has been used as a cost-effective interconnect technology in electronic packages. However, corrosion-induced failure of the Cu wire bonded interface due to the disappearance of the Cu-rich intermetallic (Cu9Al4) remains a significant reliability concern. This study proposed a corrosion mechanism of the Cu-Al ball bond interface based on the anodic polarization measurements. The observed disappearance of Cu9Al4 is the result of a two-step corrosion process: the initial penetration of the interface between Cu9Al4 and CuAl2, and the following galvanic corrosion of Cu9Al4 in the Cu-Cu9Al4 galvanic couple. This proposed corrosion mechanism emphasizes that the bond failure is caused by the penetration of the interface between Cu9Al4 and CuAl2, instead of the preferential corrosion of Cu9Al4 as perceived before.
||Planned: Supplemental Proceedings volume