|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Intermetallic Compound Movement Behavior of Cu Reinforced Composite Solder under Current Stressing
||Fu Guo, Yan Wang, Jing Han
|On-Site Speaker (Planned)
Sn grain orientations in solder matrix dominate the principal failure mechanisms in solder joints under electric current stressing. Due to Sn anisotropy, Cu diffusivity in Sn along c-axis is about 500 times faster than that along a or b axis. In the current research, 2 vol.% micron-seized Cu particles were doped in Sn-3.5Ag solder to form Cu reinforced composite solder. One-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current stress density of 104A/cm2. The effect of various Sn grain orientation on the movement behavior of the interfacial IMC and Cu6Sn5 reinforcement in solder matrix during electromigration was preliminary investigation. Under electromigration, Cu6Sn5 migrated along c-axis of Sn grain through solder joint to form specifically “Cu6Sn5 area”, while Cu6Sn5 moved away in the “non-Cu6Sn5 area” and only Sn-based solder was left. Beside, the interfacial IMC in the cathode was consumed rapidly at “non-Cu6Sn5 area”.
||Planned: Supplemental Proceedings volume