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Meeting 2017 TMS Annual Meeting & Exhibition
Symposium Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
Presentation Title Intermetallic Compound Movement Behavior of Cu Reinforced Composite Solder under Current Stressing
Author(s) Fu Guo, Yan Wang, Jing Han
On-Site Speaker (Planned) Yan Wang
Abstract Scope Sn grain orientations in solder matrix dominate the principal failure mechanisms in solder joints under electric current stressing. Due to Sn anisotropy, Cu diffusivity in Sn along c-axis is about 500 times faster than that along a or b axis. In the current research, 2 vol.% micron-seized Cu particles were doped in Sn-3.5Ag solder to form Cu reinforced composite solder. One-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current stress density of 104A/cm2. The effect of various Sn grain orientation on the movement behavior of the interfacial IMC and Cu6Sn5 reinforcement in solder matrix during electromigration was preliminary investigation. Under electromigration, Cu6Sn5 migrated along c-axis of Sn grain through solder joint to form specifically “Cu6Sn5 area”, while Cu6Sn5 moved away in the “non-Cu6Sn5 area” and only Sn-based solder was left. Beside, the interfacial IMC in the cathode was consumed rapidly at “non-Cu6Sn5 area”.
Proceedings Inclusion? Planned: Supplemental Proceedings volume


A Study of Microstructure, Electronic Flame-off Characteristics and Electrical Properties of 15um Ag-Pd-Au-Pt (APAP) Alloy Wires
Advances in High Temperature Pb-Free Composite Solder Paste Research
Corrosion Resistance for High Reliability Devices
DZ* Value of the Sn Diffuser in Cu6Sn5 under Various Current Densities
Effect of Lead-free Nanosolder Additions on the IMC Formation and Growth of Solder Paste on Cu Substrate
Effect of Ni on Mechanical Properties and Microstructure of Sn-0.7Cu and SAC307 Solder Alloys
Effective Suppression of Thermomigration-induced Cu Dissolution in Micro-scale Pb-free Interconnects by Ag3Sn interlayer
Effects of Cobalt on the Nucleation, Grain Refinement and Orientations of Sn-3Ag-0.5Cu Solder
Electrical and Mechanical Properties of Sn-Ag-Cu Solder Pastes for Reverse-offset Printing Depending on Particle Concentration
Fabrication and Characterisation of Electroplated Nanotwinned-copper Films on Polymer Substrates
Failure Mechanism and Reliability of Ag-4Pd Alloy Wire Bonded on Al-Si Metallization under High Temperature Storage and Thermal Cycle Tests in Corrosive Environments
Growth Behavior of Interfacial Intermetallic Compound at ENIG and Sn-Ag-Cu Solder Joint with Plating Temperature of Ni(P)
Impact of In Addition to Electroplated Sn in Mitigating Whisker Growth
Impact of Interrupted Thermal Cycling on Sn-Ag-Cu Interconnection Performance
In-situ Evolution of the Nanoporous Microstructure of Sintered Ag at High Temperature
In Situ Characterization of Electromigration Damage in Single Crystal and Bi-crystal Pure Tin Solder Joints
Influence of Annealing Conditions on the Microstructure of Cu-filled Through-silicon Vias
Influence of Bi on Microstructure and Properties of Sn-Cu-Ni Based BGAs on Cu Metallization
Influences of Wettability and Volume of Sn-based Solder Alloys on Self-Alignment Accuracy
Intermetallic Compound Movement Behavior of Cu Reinforced Composite Solder under Current Stressing
L-61: Effect of Component Surface Finish on the Thermo-mechanical Reliability of Lead-free High Temperature Solder Alloys
L-62: Investigation of Melting Behavior and Morphology Change of Sn Nanowires based on Infra-red (IR) Heating Method
L-63: Study on Thermomechanical Properties of Graphene-added Solder Paste for Automotive Electronics
L-64: Synchrotron X-ray Study of Sn Whisker Growth Induced by Electromigration
Long Term Isothermal Aging Effect on Reliability of Doped Lead-Free Solder Joint
Low-Temperature Cu-to-Cu Direct Bonding Enabled by Highly (111)-oriented and Nanotwinned Cu
Mechanisms of Copper Pumping and Its Impact on the Reliability of 3D Electronic Devices
Microstructural Evolution and Mechanical Performance of High-Bi, Sn-Bi Transient Liquid Phase Bonds
Microstructure and Thermomechanical Properties of Nanoparticle-added Sn-Ag-Cu Solder Paste
Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys
Nano Solder Interconnections by Low Temperature Soldering of Cu6Sn5
Nucleation and Growth of Primary Cu6Sn5 in Solder Joints
Physico-mechanical Properties and Microstructure of Sn3.0Ag0.5Cu Solder Ribbons Doped with Ni and Ni-Sn Nanoparticles
Quantifying the Role of Stress in Whisker Nucleation and Growth
Role of Indium Doping on Whisker Mitigation in Electroplated Sn
Sn Film Microstructure on the Kinetics of Spontaneous Whisker Growth
Sn Whisker Growth in Air HAST
Study of Al−Cu Compounds as Soldering Bond Pad for High-power Device Packaging
Study of Electromigration Mechanism in Pb-free Tricrystals Ball Grid Array Solder Joints
Subgrain Rotation Behavior of SnAgCu-SnPb Mixed Solder Joints in BGA Components during Thermal Shock
The Effect of Bi on the Behaviour and Properties of Sn-0.7Cu Based Alloys
The Effect of Interlayer on Abnormal Grain Growth of Nanotwinned Copper Thin Film during Annealing Process
The Grain Orientation Evolution of Mixed Solder Joints with Single-crystal Grain at the Same Position of BGA Packages during Thermal Shock
The Grain Refinement of Metal Alloy by Electromigration
The Materials Science of Solder Joints in Cu Pillar/Interposer Geometries
The Strengthening Effects of Bismuth in Aged Lead-Free Solder Alloys Characterized using Transmission Electron Microscopy (TEM)
The Variation of Grain Structure and the Enhancement of Shear Strength in SAC305-0.1Ni/Cu Solder Joint before and after Aging
Thermal Cycling Performance of Sn-0.5Cu(Pd)-Al(Si)-Ge Solder Joints for Power Control Unit of Automotive
Thermocycling Stress Induced Slip Band Sliding in Ultra-thin ENEPIG Joints
Thermodynamic and Microstructural Evaluation of the Sn-Si-Ge Ternary System for Advanced Pb-Free Solder Design
Transient Liquid Phase Processing of Sn-Cu Alloys for Soldering Applications

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