|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Synchrotron Radiation X-ray Measurement on Residual Stress in Sn Films and Kinetic Analysis of Sn Whiskers Growth
||Hao Chen, Hsin Yi Lee, Ching Shun Ku, Albert T. Wu
|On-Site Speaker (Planned)
Sn whisker growth is a spontaneous phenomenon that combines continuous stress generation and relaxation processes in Sn/Cu system. The microstructure of Sn film influences the stress relaxation processes and affects the kinetics of spontaneous Sn whisker growth. The effect of the film thickness and grain sizes on the growth behaviors was decoupled and the growth kinetics were discussed respectively. The stresses of three sets of Sn films were measured by synchrotron radiation x-ray with different annealing time. An incubation period was observed for building-up the compressive stresses in the films for the nucleation of the whiskers. The results indicated that the thickness of Sn film has a greater impact on the growth of whiskers than the grain size of Sn film. Furthermore, an empirical formula was proposed for estimation and prediction of the whisker growth behaviors.
||Planned: A print-only volume