| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Modeling of Pb-Free BGA Solder Joint Fatigue Life during Random Vibration |
| Author(s) |
Fengjiang Wang, Matthew O'Keefe |
| On-Site Speaker (Planned) |
Fengjiang Wang |
| Abstract Scope |
Development of a vibration fatigue life model to predict solder joint reliability in Pb-free ball grid array (BGA) electronic packages as a function of components location, the number and size of the solder joints, mechanical clamping positions, and the vibration Power Spectral Density (PSD) during random vibration has been investigated. Assessing solder joint reliability under these conditions is especially important for harsh environments such as space, military and automobile applications. A 3-D global/local finite element modeling technique is used to simulate the random vibration responses of different size BGAs soldered onto a polyimide printed circuit board (PCB) and to determine the stresses/strain of BGA solder joints. A vibration fatigue life model based on the Miner’s cumulative damage index (CDI) and the derived solder effective strain is then used to predict the BGA solder joint reliability. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |