|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Properties of Joints Formed With Cu-Ni/Sn High Temperature Pb-free Composite Solder Paste
||Stephanie Choquette, Iver Anderson
|On-Site Speaker (Planned)
Continued development of Cu-Ni/Sn composite solder paste as a Pb-free alternative to high-Pb solder seeks to improve reliability of printed circuit board (PCB) solder joints, even for extremely high temperatures, up to 400°C. The designed paste is predicted to be inexpensive and able to withstand elevated temperatures while still maintaining a standard commercial processing temperature around 250°C. The paste performs using liquid-phase diffusion bonding (LPDB) to form the room-temperature stable intermetallic compound (Cu,Ni)6Sn5. The nickel addition to this high-temperature phase increases joint ductility by suppressing the brittling transformation of the IMC upon cooling. New research explores limits of the paste’s reflow profile, efforts to minimize void formation, and test the paste for high temperature mechanical strength measurements. Results suggest this could be an excellent “drop-in” replacement for solders soon to be eliminated by RoHS. Foundation and Nihon-Superior, Inc. Ltd., through Ames Lab (DE-AC02-07CH11358) is gratefully acknowledged.
||Planned: Supplemental Proceedings volume