|About this Abstract
||Materials Science & Technology 2011
||MS&T'11 Poster Session
||181Tailored Chemistry of Composites Sintered by Field Assisted Sintering Technology (FAST) for Heat Sink Applications
||Aaron M Rape, Jogender Singh, Anil Kulkarni
|On-Site Speaker (Planned)
||Aaron M Rape
High performance microelectronics require superior thermal management systems. Heat sink plates that dissipate the heat generated by the microelectronic component are of critical importance for this purpose. The two primary concerns with heat sink materials are: the coefficient of thermal expansion(CTE), which should be low to match that of silicon (4) to improve long term reliability, and the thermal conductivity, which should be as high as possible to transport heat efficiently away from the microelectronic component. This study investigates several composite material systems fabricated by the field assisted sintering process (FAST). The materials can then be fabricated in a fast, one step process. Composites with varying amounts of tungsten are created and characterized to sow that by changing the amount of tungsten in the composite allows the CTE to be engineered to fit specifications. Other highly thermally conductive materials are also investigated for related heat transfer properties.