|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||The Strengthening Effects of Bismuth in Aged Lead-Free Solder Alloys Characterized using Transmission Electron Microscopy (TEM)
||André Delhaise, Doug D. Perovic
|On-Site Speaker (Planned)
One of the main concerns with lead-free solder alloys is the degradation of mechanical properties after aging, which has been shown to be detrimental towards reliability. Several studies have concluded that the inclusion of bismuth in the alloy may retard this degradation and subsequently improve reliability. While it has been speculated that these effects may be due to solid solution strengthening and precipitation hardening, the exact mechanisms have not been characterized in any significant detail. The most effective tool for such an analysis is transmission electron microscopy (TEM). This paper discusses preliminary work using TEM to investigate the strengthening effects of bismuth on aged binary tin-bismuth alloys. Sample preparation techniques are shown and described. Specific techniques utilized include Weak Beam Dark Field Microscopy (WBDFM) to study defects brought about by the inclusion of bismuth, and in situ microscopy to observe metallurgical changes that occur during aging in real time.
||Planned: Supplemental Proceedings volume