|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Effect of Ni on Mechanical Properties and Microstructure of Sn-0.7Cu and SAC307 Solder Alloys
||Mehran Maalekian, Karl Seelig
|On-Site Speaker (Planned)
In this paper the effects of micro-alloying Ni on Sn-0.7Cu and Sn-3Ag-0.7Cu (wt%) alloys and solder joints are studied. Using mechanical testing and scanning electron microscopy a comprehensive understanding on the influence of Ni micro-alloying on the interfacial reactions and mechanical properties of solder alloys is provided. It is demonstrated that Ni does not influence much the compressive strength or hardness of the alloys; however, it reduces the growth kinetics of intermetallic compound (IMC) layer for Sn-Cu in a short aging time. But Ni in Sn-Ag-Cu solder is effective to reduce the IMC thickness in both short and long aging times. It is also shown that addition of Ni makes the morphology of IMC layer smoother in the as-soldered condition and prevents the formation of thick Cu3Sn IMC for both Sn-Cu and SAC alloys.
||Planned: Supplemental Proceedings volume