|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||IMCs Growth Mechanism in Tricrystal Sn3.0Ag0.5Cu Solder Joints under Current Stressing
||Fu Guo, Jing Han, Yishu Wang, Yu Tian
|On-Site Speaker (Planned)
Copper atoms have a higher diffusivity along the c-axis than along the a-axis of the Sn grain during electromigration (EM). The intermetallic compounds (IMCs) growth behavior in tricrystal Sn3.0Ag0.5Cu ball grid array (BGA) solder joints under EM was investigated. The results show that, the c-axis direction can significantly affect the IMCs growth behavior in a tricrystal solder joint both in the solder matrix and at the interfaces under EM. The IMCs in the solder matrix and the IMCs at the cathode grow along the electron flow direction to the c-axis direction. Moreover, it seems that, in a tricrystal solder joint, the IMCs growth behavior of one grain is not affected by the other two grains with nearly 60° misorientations.
||Planned: Supplemental Proceedings volume