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Meeting 2016 TMS Annual Meeting & Exhibition
Symposium Recent Advancement on Stretchable and Wearable Electronics
Presentation Title Laser Writing and Photonic Reduction of High Performance Supercapacitors on Flexible Substrates
Author(s)
On-Site Speaker (Planned)
Abstract Scope We developed an innovative and facile approach to fabricate high performance supercapacitors on flexible substrates with femtosecond laser writing and photonic reduction. Au-graphene oxide nanocomposite is used for electrical collectors. Unlike previous studies collectors are fabricated through conventional photolithography gold electrodes is directly written by femtosecond laser reduction of Au ions. We found that gold nanoparticles can be well sintered on the surface of reduced graphene. The reduced graphene also work as glues to bridge the electrical interconnection. The measured conductivity of Au/reduced graphene reaches 10% of that of bulk gold. With optimized interdigital structure, the areal capacitor is achieved as 1.5 mF/cm2. The charge’discharge rate can be as fast as 1 KV/s. With modifying the surface properties we successfully write such an energy device on various flexible substrates, such as, paper and polyimide. High performance supercapacitors can find attractive applications in portable device, wearable electronics and biomedical micorsystems.
Proceedings Inclusion? Planned: TMS Journal: Journal of Electronic Materials

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

3D Printing Liquid Metals at Room Temperature for Fabrication of Functional, Stretchable, and Soft Electronics
A New Architecture for Flexible Large-area Electronic Systems
B-1: Printing of Graphene-coated Copper Nano-ink on Flexible Substrate Using Light Sintering Method
DFT Approach to Electronic and Optical Properties of Foldable and Stretchable Graphene
Flexible Copper Clad Laminate prepared by Roll-to-Roll Additive Manufacturing
Inkjet Printed Metal Oxide Thin Film Transistors
Laser Writing and Photonic Reduction of High Performance Supercapacitors on Flexible Substrates
Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
Mechanical Stability of Printed Metallizations on Polymer Substrates
New Paradigms for Enabling Printing of Flexible Optoelectronics through Engineered Metal-organic Inks and Direct Writing
Post Processing and In Situ Processing for Low Thermal Budget Integration of Electronic Materials on Flexible Substrates
RF Devices based on 2D Materials for Flexible and Wearable Electronics
Self-sensing Ionic Polymer-metal Composite Soft Robotic Actuator Integrated with Gallium-indium Alloy
Silver Nanowire Networks for Flexible Electromagnetic Interface Shields
Ultrasonic Spray Printing for High-performance Flexible Organic Field-effect Transistors and Hybrid Perovskite Solar Cells
Wearable Energy Storage Devices from Cotton T-shirts
Wireless Gas Sensing with NFC-enabled Mobile Device

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