|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||Phase-field Modeling of Grain-boundary Grooving and Surface Drift under Homogeneous Electromigration
||Arnab Mukherjee, Kumar Ankit, Britta Nestler
|On-Site Speaker (Planned)
Comprehension of interplay between various diffusion pathways in polycrystalline interconnects during electromigration (EM) holds central importance in enhancing microelectronic reliability. Here, we investigate the role of potential diffusion pathways during EM in polycrystalline interconnects using a phase-field method that additionally accounts for electron wind force. Focusing on the homogeneous EM regime, we consider the evolution of grooves under the cumulative influence of capillary and electromigration-mediated surface diffusion (between the interconnect and the underlayer) and electromigration-induced grain-boundary diffusion (in the interconnect) on a drift test geometry. The groove morphology under EM-dominated regime is found to differ significantly when compared to the classical Mullins' profile. Furthermore, a detailed parametric study reveals the onset of EM modulated healing flux as the entire surface drifts with constant velocity. Finally, the role of grain coarsening on EM-induced damage in polycrystalline thin films is discussed.
||Planned: Supplemental Proceedings volume