|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||FF-5: Joint Properties of Sn-Cu-(X)Al(Si) for Automotive Electronics Modules
||Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang, Chang-Woo Lee
|On-Site Speaker (Planned)
Joint properties of ECU module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) alloys were fabricated as bar-type by doped various weight percentages(0.01 and 0.03wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type alloys with a diameter of 450um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and 230.8℃, respectively. The ball-type solders were attached to PCB with flux and reflowed. The peak temperature of reflow was 260℃ for 50s above melting temperature. And then, we measured shear strength of two Al(Si) solder materials compared to Sn-0.7Cu. Moreover, thickness and grain size of Cu6Sn5 IMC were measured and compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the Cu6Sn5 thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.
||Planned: A print-only volume