|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||2016 Technical Division Student Poster Competition
||SPG-23: Coupled Infrared Thermography and Digital Image Correlation for Advanced Characterization of Material Behavior during Hot Stamping
||Nan Zhang, Fadi Abu-Farha
|On-Site Speaker (Planned)
Material behavior during hot stamping processes is significantly influenced by deformation and temperature gradients. Experimental investigation of transient material deformation under continuous cooling is not adequately addressed in the literature, despite the fact that it is crucial for the validation of material models and finite element simulations of hot stamping operation. In this work, infrared thermography and digital image correlation (DIC) were used to enable full-field non-contact measurements of both temperature and deformation distributions during non-isothermal tensile testing that simulates a hot stamping process. The two measurement techniques were coupled together that enables direct mapping of temperatures and strain. The non-isothermal stress-strain curves were generated to validate proposed constitutive models fed with evolving temperature and strain paths. Moreover, the experimental results are used to calibrate and verify a fully coupled thermo-mechanical finite element simulation tool implemented with a user defined subroutine to study the hot stamping of aluminum alloy sheets.
||Definite: None Selected