|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Late News Posters
||PP-26: Phonon Wave-packet Simulations for the Prediction of Thermal Boundary Conductance
||ChangJin Choi, Nick Roberts
|On-Site Speaker (Planned)
Thermal transport in nanoscale electronic devices is dominated by phonon interactions at the interfaces and is strongly influenced by the mass and bond strength of the constituent materials forming the interface. In order to understand phonon transport behavior, methods directly measure the modal contribution to thermal boundary conductance (TBC) must be used.
This study uses phonon wave-packet simulations to explore the contributions of the mass and the bond energy differences as well as interdiffusion on the TBC at the interface. As a result, the frequency dependence of phonon transmission probability is observed. The interdiffusion creates a different energy distribution by allowing high frequency phonons to contribute to energy transport by inelastically scattering into multiple lower frequency phonons. This results show that the level of inelastic scattering is dependent on the level of nanoscale imperfection at the interface and thus the TBC can be tuned by controlling this inelastic scattering level.