| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Improvement of Wettability and Thermal Properties at Bi Based Alloys |
| Author(s) |
Minoru Ueshima |
| On-Site Speaker (Planned) |
Minoru Ueshima |
| Abstract Scope |
There is Bi based alloy as candidate to replace Pb-rich alloy because of the high melting point, but Bi is hard to get wet with Cupper electrode becase it doesn't form any intermetalic compound with Cupper. We try to improve the wetting properies of Bi on Cu by addition of small amount of Sn and In. Increase of Sn and In at Bi alloys make the wettability on Cu better, but however the soldius line of the alloys decrease to be 139 centigrade degree. It was found that the additoin of Cu and Ag is effective to restrict decreasing the solidus line. In this study, the wetting properties of Bi-xSn and Bi-xIn alloys (x=0.5,1,3,6) on Cu electrode are researched and the soldering process to restrict the decrease of the solidus line at Bi-Sn-Cu alloy is proposed. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |