Cong Zhao received his B.S. degree in Mechanical Engineering from Central South University in China at 2011, and then got his Master’s degree in Industrial Engineering from Georgia Institute of Technology, Atlanta, Georgia, in 2013. He is currently a Ph.D. candidate in Industrial and Systems Engineering Department of Auburn University, Auburn, Alabama. As a research assistant in the NSF Center for Advance Vehicle and Extreme Environment Electronics (CAVE3) of Auburn University, his current research interests include board level reliability analysis of Pb-free solder alloy under harsh environment, surface mount technology (SMT) packaging and process, and development of new solder alloy materials. Cong is a member of SMTA, IEEE, IMAPS, TMS and ASME, and has been inducted into the Tau Beta Pi and Phi Kappa Phi honorary societies. Cong has authored or co-authored near 10 technical publications, including one paper selected as Best Student Paper of SMTAI 2015.