|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Investigation of Processes Leading to Whisker Growth in Tin Thin Films with Advanced Multi-physics Simulations
||Aritra Chakraborty, Philip Eisenlohr, Pratheek Shanthraj
|On-Site Speaker (Planned)
Tin whiskers pose a serious concern to device reliability in the electronic industry as they nucleate in unpredictable locations, can grow to a length of several millimeters and are able to short-circuit different parts of the electronic assembly. The formation of Cu6Sn5 intermetallic compounds (IMCs) under service conditions result in heterogeneous stress fields due to the lattice anisotropy of β-Sn. This alters the chemical potential of vacancies causing a redistribution of mass within the film in addition to plastic relaxation. In this study we perform a coupled, three-dimensional, full-field simulation of crystal plasticity deformation and mass transport to understand the overall chemo-mechanics of tin thin films and how it might be linked to whisker nucleation sites; investigate the influence of initial texture on stress evolution; and the effect of plastic anisotropy on the stress relaxation that also governs the overall mass transport.
||Planned: Supplemental Proceedings volume