|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Copper-to-copper Direct Bonding on Highly (111) Oriented Nano-twinned Copper in N2 Ambient
||Jing-Ye Juang, Chia-Ling Lu, Kuan-Ju Chen, Chih Chen, King-Ning Tu
|On-Site Speaker (Planned)
A vacuum-free Cu-to-Cu direct bonding by using the (111) oriented nano-twined-Cu has been achieved. A short bonding time (5 min) under a temperature gradient between 450 °C and 100 °C to obtain well bonded joints is developed. There is no need for the additional thermal annealing treatment after the bonding. To investigate the grain growth behavior across the bonding interface, further bonding experiments for 10, 15 and 20 min in the same temperature gradient were conducted. It was found the grain boundary movement is anisotropic. A reversed thermal bonding experiment by reversing the temperature gradient was performed to verify the observed anisotropic grain growth behavior. Furthermore, the bonding mechanism on the basis of surface diffusion creep has been proposed. In this study, the Cu-to-Cu direct bonding by (111) oriented nt-Cu as well as the grain evolution across the bonding interface has been achieved and verified.
||Planned: Supplemental Proceedings volume