|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Microstructure and Thermomechanical Properties of Nanoparticle-added Sn-Ag-Cu Solder Paste
||Kyoung-Ho Kim, Jung-Hwan Bang, Junichi Koike, Jonghyuk Yoon, Songhee Yim, Bum-Gyu Baek, Jae-Pil Jung, Sehoon Yoo
|On-Site Speaker (Planned)
The microstructure and thermomechanical reliabilities of a La2O3-nanoparticle-added Sn-3.0wt%Ag-0.5wt%Cu (SAC305) nano-composite solder paste were investigated in this study. The nano-composite solder paste was printed on a PCB and was reflowed with a peak temperature of 250C. The thermomechanical reliability was evaluated with a thermal shock test with temperature range of -40°C - 125°C. After the thermal shock test, the mechanical properties were measured with a high speed shear test and a lead-pull test. The growth rate of intermetallic compound (IMC) for the nano-composite solder showed lower than that for the conventional solder. The nano-composite solder possessed higher shear strength and toughness than conventional solder after thermal shock test. After 2000 cycles of thermal shock test, the nanocomposite solder did not show any crack formation at the solder joints while crack propagation were observed for the conventional solder joint.
||Planned: Supplemental Proceedings volume