|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Mechanical Behavior at the Nanoscale III
||Microstructural Evolution of Nanocrystalline Copper-tantalum Alloy
||Mansa Rajagopalan, Scott A. Turnage, Kristopher A. Darling, Mark A. Tschopp, Kiran N. Solanki
|On-Site Speaker (Planned)
Understanding the behavior of materials through systematic evaluation of microstructure with deformation is critical for designing materials for engineering applications. This study investigates the microstructure evolution of a binary nanocrystalline copper- 10 at. % tantalum alloy prepared through mechanical alloying and consolidated through equal channel angular extrusion (ECAE). The material system was then subjected to high strain rate experiments (103/s to 104/s) at elevated temperatures (25 °C to 800 °C). Mechanical testing results show stable flow stress response with increased strain rates and temperatures. Subsequent TEM/STEM characterization reveals the presence of Ta clusters which aid in the observed superior grain stabilization. Deformation is found to be the result of the nucleation and growth of coherent and incoherent twin boundaries. Further, results indicate that with an increase in temperature, the initial flow stress reduces as increased thermal energy leads to a decrease in the mechanical energy required to generate twin boundaries.
||Planned: A print-only volume