|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Advanced Magnetic Materials: An FMD Symposium in Honor of Michael E. McHenry
||Magnetic Nanoparticle-based Solder Composites for Electronic Packaging Applications
||Siyang Xu, Ashfaque Habib, Michael E. McHenry
|On-Site Speaker (Planned)
SnAgCu (SAC) solder-FeCo magnetic nanoparticles (MNP) composite pastes with varying MNP concentration were reflowed locally in AC magnetic fields to minimize eddy current heating in printed circuit board. DSC results show reduced undercooling with the addition of MNPs. TEM results show MNPs are distributed in Sn matrix. SEM results show a decrease in Sn dendrites and more homogeneous dispersed Ag3Sn with the addition of MNPs. MNPs promote Sn solidification by providing heterogeneous nucleation sites at low undercooling. MNPs also enhanced mechanical properties by grain boundary and dispersion strengthening. The reflow of solder composites in area-array package was modeled based on eddy current power loss and magnetic power loss. Solder-MNP composites with modest MNP loading showed temperature increases sufficient to achieve solder reflow when subjected to AC magnetic field. Thermomechanical behavior of a solder joint was also modeled under cyclic temperature variations.
||Planned: None Selected