|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Thermal Cycling Reliability of Solder and NiSn Solid‒liquid Interdiffusion Joints with Thermal Coefficient Mismatch: Influence of Mechanical Properties of Joint Materials
||Hirofumi Ito, Makoto Kuwahara, Masanori Usui
|On-Site Speaker (Planned)
We investigated the stress generated in Si chips joined to Cu plates with Pb–10%Sn, Sn–0.7%Cu, and Sn–10%Sb solders, and NiSn solid–liquid interdiffusion (NiSn−SLID) under thermal cycling (−40°C to 200°C). At room temperature (20°C), all chips exhibited compressive stress, and the highest stress was observed in the NiSn−SLID joint. Under thermal cycling, the stress in all solder joints changed repeatedly from compressive to tensile stress and vice versa. However, the stress in the NiSn−SLID joint remained compressive. In addition, we investigated the fracture behaviour of the NiSn−SLID joints with SiC chips and Cu plates under thermal cycling. After 500 cycles, a crack was observed on the SiC electrode, and it progressed to the Cu plate through the NiSn intermetallic layer. These differences in stress and fracture behaviours could be attributed to variations in the strength and resistance against plastic deformation of the joint materials.
||Planned: Supplemental Proceedings volume