|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Multi Axis Loading Impact in Via-in Pad Plated Over (VIPPO) Board Design on Thermal Cycling Performance
||Tae-Kyu Lee, Mohamed Sheikh, Andy Hsiao , Weidong Xie, Steven Perng
|On-Site Speaker (Planned)
The demand on faster signal-speed drive the printed circuit board design to a more complex and higher density structure configuration. A few of the recent trends are the board thickness increase and higher rate of via-in pad implementation. With higher density of these Cu via inside the board, the thermal cycling performance of the ball grid array (BGA) components varies with different via configuration since localized deformation mechanism are altered due to Cu distribution. Especially, the implementation of via-in pad plated over (VIPPO) design configuration induced additional loading conditions to each BGA interconnects resulting in a lower than expected thermal cycling performance. Thermal cycling on memory components with and without VIPPO boards are evaluated. Specific pad design parameters degrade the thermal cycling performance over 40%. The degradation mechanism and the multi axis loading condition due to the VIPPO configuration will be presented and discussed.
||Planned: Supplemental Proceedings volume