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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
Presentation Title Nanoparticles and Nanowires Based on Ag and Cu in Printed Electronics and Transparent Electrode
Author(s) Hyuck Mo Lee
On-Site Speaker (Planned) Hyuck Mo Lee
Abstract Scope Ag-based nanoparticles are one of the most widely studied materials due to high electrical conductivity and stability. Simultaneously, Cu-based nanoparticles and nanowires attract much attention as conductive materials with low cost compared to that of Ag. However, the undesirable oxidation tendency of Cu-based nanomaterials is the main issue for conductive electrodes. Alloying and coating strategies with Ag were suggested to protect Cu nanoparticles from oxdiation. We fabricate the Ag, Cu and Ag-Cu bimetallic nanoparticles with alloy and core-shell structures using oleylamine-based synthesis, and ligand exchange study has been performed to lower sintering temperature. Cu nanowires were also synthesized using both water-based and oleylamine-based methods. Ethylenediamine and polymethyl methacrylate were used to protect Cu nanowires from oxidation. The anti-oxidation properties were confirmed through density functional theory and X-ray photoelectron spectroscopy. Applications of conductive nanoparticles and nanowires based on Ag and Cu for printed electronics and transparent electrode are also briefly introduced.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Phase-field Model on Electromigration-induced Transgranular Void Migration in Interconnects
Alloy Phase Stability under Electric Currents
Dissolution Kinetic of Ni Wire in Sn and Sn3.5Ag Solder
Effect of Ag Additives on Dissolution Kinetic of Cu Wire in Sn and Sn3.5Ag Solder
Effects of Electrochemical Parameters on the Physical Properties of Ni-Co Electroplating
Electric Current-induced Slip/Twin Transition: An In Situ EBSD Study
Electrochemical Etching of Solder Resist to Improve Adhesion of Electroless Copper Plating in PCB
Fabrication and Characterization of (111)-oriented and Nanotwinned Cu by Periodic Reverse Electrodeposition
Ga-doping Effect upon Sn-0.7Cu/Cu Interfacial Reactions and the Isothermal Section of Sn-Cu-Ga Ternary System
High-entropy Oxides Li(Ni0.2Mn0.2Co0.2Zn0.2Cu0.2)O2 as Cathode Materials for Lithium-ion Batteries
Inter-diffusion at Ag/Cu Interface
Interfacial Reaction Studies in SLID Bonding Processes Using Ga and In
Hide details for [<a href="/PM/PM.nsf/ApprovedAbstracts/7B7A9BA8C19DD3BE85258150001FB51F?OpenDocument">Interfacial Reactions beInterfacial Reactions between Lead-free Solders and Cu-xZn Alloys
[Replication or Save Conflict]
Interfacial Reactions in the Au/Sn/Ni/Cu Multilayer Couples
Liquidus Projection of Quaternary Ge-Sn-Co-Sb System and Thermoelectric Properties of Sn/Ge Doped Skutterudite CoSb3
Mechanical Properties of In-33.7Bi Alloy for Low Melting Temperature Solder
Microstructure and Optical Properties of Cr1-xAlxN Films Synthesized by Reactive Magnetron Sputtering
Microstructure Evolution due to Isothermal Reactive Diffusion between Solid Co and Liquid Sn
Microstructure Evolution of Al Wire Bonded on Cu Metallization under Electromigration Test
Minor P-doping in the Electroplated Co(P) Layer to Strongly Suppress IMC Formation in Lead-free Solder Joints
Nanoparticles and Nanowires Based on Ag and Cu in Printed Electronics and Transparent Electrode
On the Existence of a Two-phase Field in Binary α-Cu(Al) Solid Solutions
Phase Equilibria of the Li-Si-C System for Advanced Anodes in Li-ion Batteries
Predication of the Intrinsic Properties of Multi-component Electrodes for Li-ion Batteries from Aspect of Thermodynamics
Solid-solution Cu-to-Cu Interconnection Fabricated with Sub-micron Ga-based Pastes
Structural Stability and Chemical Reactivity of Nanoscale Twinning Structure in Copper Nanowires
The Electromigration Effect Revisited: An In Situ SEM and SR-based XRD Study
The Investigation of Electromigration Defects on Cu/Sn and Cu/Ag IMC due to Currents Stress and Temperature
The Role of Retained Structures in Phase Transition and Piezoelectric Properties of PMN-PT Single Crystals
The Study of Interfacial Reactions between Sn and C194 Alloy
Thermodynamic Stability Maps for the La0.6Sr0.4Co0.2Fe0.8O3▒δ–SO2–O2áSystem for Application in Solid Oxide Fuel Cells

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