| About this Abstract |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Thermodynamics and Kinetics of Alloys
|
| Presentation Title |
Thermal Grooving and Grain Growth in a Polycrystalline Thin Film: A Phase-field Study |
| Author(s) |
Miral Verma, Sandeep Sugathan, Saswata Bhattacharya, Rajdip Mukherjee |
| On-Site Speaker (Planned) |
Rajdip Mukherjee |
| Abstract Scope |
In this study, we aim to study the effect of thermal grooving on grain boundary motion and explore the effects of film thickness, surface/grain boundary energy, and surface mobility on grain growth. Towards achieving this goal, a three-dimensional phase-field model is employed that can simulate concurrent curvature-driven grain growth and surface-diffusion-controlled thermal grooving. The simulated surface profile for a bicrystal shows excellent agreement with Mullins’ classical theory of mobile grooves for any groove shape. We also report the existence of a universal behavior of a mobile thermal groove. In polycrystalline thin films, we find that with the decrease in film thickness, the degree of stagnation increases, manifested by an increase in deviation from the ideal grain growth behavior. We observe that complete stagnation of grain structure is only possible when all the grains are larger than a critical grain size that corresponds to a critical grain boundary curvature. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Thin Films and Interfaces, Computational Materials Science & Engineering, Modeling and Simulation |