|About this Abstract
||Materials Science & Technology 2019
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Effect of Reducing Agent on the Joint Strength of Sintered-joint with Cu Paste
||Soonyong Kwon, Yong-Ho Ko, Jeong-Hwan Bang, Hoo-Jeong Lee, Sehoon Yoo
|On-Site Speaker (Planned)
A reducing agent was added in a binder for Cu paste and the effect of the reducing agent on the shear strength of the sinter-joint with the Cu paste was evaluated. The reducing agent remove the oxide layer of the Cu particles at an elevated temperature. The fabricated Cu paste was printed on a direct bond copper (DBC) substrate and a chip was mounted on the Cu paste. Then the Cu paste was sintered at the temperature range of 250 - 350℃. The sintered time was also varied from 10 to 30 min. The shear strength of the sinter joint with the reducing agent was higher than that without the reducing agent. In addition, the shear strength was varied with the content of the reducing agent.
||Definite: At-meeting proceedings