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Meeting Materials Science & Technology 2019
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Presentation Title Effect of Reducing Agent on the Joint Strength of Sintered-joint with Cu Paste
Author(s) Soonyong Kwon, Yong-Ho Ko, Jeong-Hwan Bang, Hoo-Jeong Lee, Sehoon Yoo
On-Site Speaker (Planned) Soonyong Kwon
Abstract Scope A reducing agent was added in a binder for Cu paste and the effect of the reducing agent on the shear strength of the sinter-joint with the Cu paste was evaluated. The reducing agent remove the oxide layer of the Cu particles at an elevated temperature. The fabricated Cu paste was printed on a direct bond copper (DBC) substrate and a chip was mounted on the Cu paste. Then the Cu paste was sintered at the temperature range of 250 - 350℃. The sintered time was also varied from 10 to 30 min. The shear strength of the sinter joint with the reducing agent was higher than that without the reducing agent. In addition, the shear strength was varied with the content of the reducing agent.
Proceedings Inclusion? Definite: At-meeting proceedings

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Model Study of Microstructure Evolution and Bi Diffusion in Sn-Bi Low Temperature Soldering Systems
Corrosion Behavior of Electroplated and Electroless Plating Ni/Pd/Au Surface Finish on Automobile Printed Circuit Board
Effect of Reducing Agent on the Joint Strength of Sintered-joint with Cu Paste
Effect of Thermal Annealing on Structural Integrity of Cu-filled-through Si Via (TSV)
Heated Mechanical Cycling as a Substitute for Thermal Cycling - A Preliminary Investigation for a New Failure Analysis Technique
IMC Evolution as a Function of Grain Orientation under High Current Density in Sn-based Solder Joints
Instability Detection in Press-fit Connector Pin Interconnects after Thermo-mechanical Cycling
Interfacial Reactions in Co/Ag-Cu, Ni/Ag-Cu, Co/Ag-Sb and Ni/Ag-Sb Couples
Micro Interconnect Mechanical Stability in Cryogenic Temperature Environment
Micro Interconnect Shear and Creep Performance under Current Stressing
Microstructure Evolution in Cu and Ag Coated Cu Particle Sintering for Power Module Interconnection
Predicting Electromigration-mediated Damage in Interconnects Using Phase-Field Models
Stretchable Joint with Ag-PDMS for Wearable Electronics
Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration

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