|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Mechanical Properties of Ni3Sn4 by Micropillar Compression and Nanoindentation
||Li-Jen Yu, J. J. Yu, J. Y. Wu, C. R. Kao
|On-Site Speaker (Planned)
The mechanical behavior of Ni3Sn4 intermetallic compound with different crystallographic orientations was investigated by using micropillar compression and nanoindentation. The crystal of Ni3Sn4 was prepared by alloying and some annealing twins were discovered after aging at high temperature. Micropillars were fabricated from Ni3Sn4 crystal by focus ion beam and then tested by picoindenter. We also conducted nanoindentation testing for comparison. The stress-strain behavior from micropillar compression testing shows that Ni3Sn4 exhibits good strength and elongation. Several pillars with certain orientation even did not undergo catastrophic fracture after complete testing process. Some traces of slipping corresponding to certain crystallographic plane were discovered.
||Planned: A print-only volume