|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||The Effect of Bi on the Behaviour and Properties of Sn-0.7Cu Based Alloys
||Keith Sweatman, Selena Smith, Arif Salleh, Stuart McDonald, Takatoshi Nishimura, Kazuhiro Nogita
|On-Site Speaker (Planned)
With Pb contamination no longer a significant risk Bi is being used increasingly as a beneficial addition to Pb-free solder alloys. The solid solution strengthening effect that Bi provides to the β-Sn matrix has the significant advantage over the particle strengthening effect of Ag of being stable during extended ageing. However the effects of Bi on phase equilibria and mechanical properties of established Pb-free solder alloy systems such as Sn-Cu and Sn-Cu-Ni are not yet well understood. In this paper the authors will report some of the results emerging from systematic studies of the effect of Bi on β-Sn lattice parameters, wetting and IMC formation on substrates, on hardness, elastic modulus and the accumulation of strain in solder alloys based on Sn-0.7Cu. These observations will be related to the results of high speed ball shear testing in which a Sn-Cu-Ni alloy with a Bi addition outperforms SAC alloys.
||Planned: Supplemental Proceedings volume