|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||Development of Sn-free and Sn-containing Low Melting Solder Alloys
||Chih-Hao Chen, Albert T. Wu, BoonHo Lee, HsiangChuan Chen, ChangMeng Wang
|On-Site Speaker (Planned)
In recent decades, diverse products emerge with various requirements for manufacturing and reliability. In some products, such as light emitting diodes (LEDs), biosensor, and molded interconnect device (MID) plastics, soldering temperature is one of the most difficult challenges in the manufacturing processes. High temperature packaging process reduces the total life time and also degrades the yield of the products. New solder alloy has to be developed for low temperature applications. In this study, tin-containing and tin-free low melting solder with melting point at 82 oC and 95 oC are developed. The morphology of the intermetallic compounds (IMC) at the interfaces and in the solders are reported. The alloys were assembled to flip chip test vehicles for ball shear test, drop test, and thermal cycling test to evaluate the possible applications in real devices.
||Planned: Supplemental Proceedings volume