|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Thermal and Mechanical Stability of Nanocrystalline Materials
||The Mechanism of Anisotropic Single-crystal Growth in Nanotwinned Copper
||I-Hsin Tseng, Chih Chen, Yun-Ting Hsu, Jih-Perng Leu, Tu King-Ning
|On-Site Speaker (Planned)
In this study, we measure the thermal stress of highly (111)-oriented nt-Cu through the thermal cycling tests by bending beam system. First, we electroplate the nanotwined copper (nt-Cu) on TiW/Cu substrates by direct current. The area is 1 cm X 5 cm and the thickness of the film is 3.8 um . The copper film was heated up at a heating rate of 1℃/min from room temperature to 400℃, and then cooling down to room temperature by the same rate as heating . We can obtain the curve of stress-temperature of DC nt-Cu . Furthermore, we investigate the grain growth in the copper films which at different temperatures to find out the impact of thermal stress on grain growth. The result shows that the copper grain growth begin at the temperature at the maximum compressive thermal stress .
||Planned: Supplemental Proceedings volume