| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Comparison of Solder Joint Nucleation Control and Reflow Microstructures in Sn-Cu and Sn-Ag-Cu with Minor Additions |
| Author(s) |
Iver Anderson, Joel Harringa, Adam Boesenberg, Fran Laabs, Alfred Kracher |
| On-Site Speaker (Planned) |
Iver Anderson |
| Abstract Scope |
Although minor additions of some 4th elements (X=Zn, Mn, and Al) were found to be effective solidification catalysts in near-eutectic Sn-3.5Ag-0.95Cu (SAC3595) solder joints, linked studies of undercooling and joint microstructure have not been performed with similar Sn-Cu (SC) solders with the same additions. It is possible that a similar alloying effect could give joint microstructure control to SC solder since Ag may not be critical in nucleation of SAC+X joint solidification. Common additions to SC solder of Ni and Co also will be included to provide increased understanding of their influence on SC+X joint microstructure development. The work will utilize a simple (Cu/Cu) solder joint that is suited for direct differential scanning calorimetry and microstructural analysis by SEM and electron microprobe to investigate these effects, studying interfacial segregation and substitution into intermetallic phases. Support from Iowa State University Research Foundation and from Nihon-Superior through Ames Lab contract no. DE-AC02-07CH11358. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |