About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
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Thermodynamics and Kinetics of Alloys
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Presentation Title |
Low Temperature Phase Equilibria Investigation and Phase Identification in the Cu-In-Sn System |
Author(s) |
Fu-Ling Chang, Han-Tang Hung, I-Chieh Fang, Yu-Hsin Lin, C.Robert Kao |
On-Site Speaker (Planned) |
Fu-Ling Chang |
Abstract Scope |
Nowadays, many applications require low soldering temperature process to avoid chip warpage and energy wasting during soldering. In-48Sn eutectic alloy was considered as a promising material to use at low temperature bonding, which with low melting temperature, excellent mechanical properties, high thermal conductivity and long fatigue life. In most cases, the application of this alloy is typically below 150°C, however, there is almost no information about the Cu-In-Sn phase diagram at this temperature region. In addition, there is no consensus on whether the intermetallic compound that appears at low temperature is Cu (In, Sn)2 or Cu2In3Sn. In this work, the Cu-In-Sn experimental phase diagram at 100, 80, 60°C and room temperature were studied, and the thermodynamic parameters for describing Cu-In-Sn phase equilibria were optimized, the agreement between the calculated and experimental results was also obtained. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Joining, Computational Materials Science & Engineering |