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Meeting 2016 TMS Annual Meeting & Exhibition
Symposium Recent Advancement on Stretchable and Wearable Electronics
Presentation Title Post Processing and In Situ Processing for Low Thermal Budget Integration of Electronic Materials on Flexible Substrates
Author(s) Joo Hyon Noh, Pushpa Raj Pudasaini, Pooran Joshi, Philip D. Rack
On-Site Speaker (Planned) Joo Hyon Noh
Abstract Scope For numerous electronic device applications, such as flexible/rollable displays, electronic skin or wearable electronics, the key requirement is the direct fabrication of electronic devices, especially thin-film transistors (TFTs), on flexible substrate. Although indium gallium zinc oxide (IGZO) has been extensively studied as a channel layer of TFTs due to superior electrical properties, excellent large-area uniformity, and low process temperature, the IGZO formed either by room temperature vacuum deposition technique or by sol-gel process inevitably requires a thermal treatment for device performance improvement, which is often not compatible with temperature sensitive flexible polymer substrates. Pulse-thermal-processing (PTP) has been exploited for the low thermal budget integration of IGZO TFTs as well as nanoparticle/oxide sensor platforms on thermally sensitive polymer substrates. In addition, ionic liquid gated devices and an athermal activation of IGZO TFTs will be presented. Finally, electron beam induced deposition of functional nano-materials will be demonstrated.
Proceedings Inclusion? Planned: TMS Journal: Journal of Electronic Materials

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

3D Printing Liquid Metals at Room Temperature for Fabrication of Functional, Stretchable, and Soft Electronics
A New Architecture for Flexible Large-area Electronic Systems
B-1: Printing of Graphene-coated Copper Nano-ink on Flexible Substrate Using Light Sintering Method
DFT Approach to Electronic and Optical Properties of Foldable and Stretchable Graphene
Flexible Copper Clad Laminate prepared by Roll-to-Roll Additive Manufacturing
Inkjet Printed Metal Oxide Thin Film Transistors
Laser Writing and Photonic Reduction of High Performance Supercapacitors on Flexible Substrates
Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
Mechanical Stability of Printed Metallizations on Polymer Substrates
New Paradigms for Enabling Printing of Flexible Optoelectronics through Engineered Metal-organic Inks and Direct Writing
Post Processing and In Situ Processing for Low Thermal Budget Integration of Electronic Materials on Flexible Substrates
RF Devices based on 2D Materials for Flexible and Wearable Electronics
Self-sensing Ionic Polymer-metal Composite Soft Robotic Actuator Integrated with Gallium-indium Alloy
Silver Nanowire Networks for Flexible Electromagnetic Interface Shields
Ultrasonic Spray Printing for High-performance Flexible Organic Field-effect Transistors and Hybrid Perovskite Solar Cells
Wearable Energy Storage Devices from Cotton T-shirts
Wireless Gas Sensing with NFC-enabled Mobile Device

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