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Meeting 2016 TMS Annual Meeting & Exhibition
Symposium Recent Advancement on Stretchable and Wearable Electronics
Presentation Title Post Processing and In Situ Processing for Low Thermal Budget Integration of Electronic Materials on Flexible Substrates
Author(s) Joo Hyon Noh, Pushpa Raj Pudasaini, Pooran Joshi, Philip D. Rack
On-Site Speaker (Planned) Joo Hyon Noh
Abstract Scope For numerous electronic device applications, such as flexible/rollable displays, electronic skin or wearable electronics, the key requirement is the direct fabrication of electronic devices, especially thin-film transistors (TFTs), on flexible substrate. Although indium gallium zinc oxide (IGZO) has been extensively studied as a channel layer of TFTs due to superior electrical properties, excellent large-area uniformity, and low process temperature, the IGZO formed either by room temperature vacuum deposition technique or by sol-gel process inevitably requires a thermal treatment for device performance improvement, which is often not compatible with temperature sensitive flexible polymer substrates. Pulse-thermal-processing (PTP) has been exploited for the low thermal budget integration of IGZO TFTs as well as nanoparticle/oxide sensor platforms on thermally sensitive polymer substrates. In addition, ionic liquid gated devices and an athermal activation of IGZO TFTs will be presented. Finally, electron beam induced deposition of functional nano-materials will be demonstrated.
Proceedings Inclusion? Planned: TMS Journal: Journal of Electronic Materials


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