|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Advanced Characterization Techniques for Quantifying and Modeling Deformation
||BB-5: Effect of Grain Boundary on the Surface Roughness in Single-point Diamond Turning Annealed Copper
||Jianchao Yu, Gang Wang, Yiming Rong
|On-Site Speaker (Planned)
The grain boundary can be found in the machined surface in single-point diamond turning annealed copper, which cannot be explained by conventional macro cutting mechanism. The transmission electron microscope (TEM) and nanoindentation tests were carried out to explain this phenomenon. The experimental results showed that the grain boundary had higher dislocation density and nanohardness than the grain interior, which will result in the material piling up near the grain boundary during cutting. Therefore causes the local surface roughness increase. A physics constitutive model based on dislocation evolution and thermal dynamic analysis was proposed. Then the constitutive model was implemented into the commercial software Abaqus/Explict to catch the dislocation movement near the grain boundary. The simulation results can reflect the interaction between dislocation and grain boundary well in cutting process, which will be used to reveal micro cutting mechanism furthermore.
||Planned: EPD Congress Volume