|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||WBG Die-attach Ceramic Substrate for Severe Thermal Cycling
||Katsuaki Suganuma, Hao Zhang, Shijo Nagao, Tohru Sugahara, Minoru Ueshima, Yoichi Furukawa, Kazuhiko Minami, Hans Albrecht, Klaus Wilke, Yoshinori Shirakawa, Seigo Kurosaka, Masanobu Tsujimoto, Masayuki Kiso
|On-Site Speaker (Planned)
Metal plate bonded ceramic substrates have been widely used in industries as one of the superior insulating substrate for power electronics. They are called as DBC (direct bond copper), DBA (direct bond aluminum) or AMC (active metal brazed copper). These substrates are currently used for the conventional Si power devices, of which operation temperature is kept below 150 °C. Now a day, much severer operation temperatures are required for the next generation of power devices not only with Si but also with SiC or with GaN. The temperature can beyond 200 °C, especially at the semiconductor junction, and the substrate will be suffered from very severe temperature cycling environment. This work was carried out to find out the best materials conditions for ceramic insulating substrate focusing on ceramic core materials, metallic plates, plating materials and interconnection materials for thermal cycling between -40 °C and 200 °C.
||Planned: A print-only volume