|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV
||Stress and Currents Density Effects on Copper-Tin Intermetallic Compound Formation
||Yue-Lin Lee, Jhou-Cheng Wu, S.-F. Lin, Ming-Tzer Lin
|On-Site Speaker (Planned)
Cu-Sn intermetallic compound (IMC) is the most common and important IMC formed between Sn-based solders and Cu substrates during soldering. The current density and stress on the Cu-Sn IMC could have significantly effects on the electromigration but very little was known. Here, a bulge test was performed to investigate the influence of the current density and external stress on the growth of Cu-Sn intermetallic compound. The bulge height was to maintain the stress of the specimens simultaneously having electrical current passing through it. Samples were tested under different tensile stress as well as under different tensile stress and current density (10^4 A/cm^2) with respect to the annealing temperature of 100℃ and 200℃. The results show significantly electromigration effects with the external tensile stress and current density. The effects of stress and current density were presented and discussed.
||Planned: A print-only volume