About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Advanced Characterization Techniques for Quantifying and Modeling Deformation
|
Presentation Title |
Statistical Assessment of Strain Localization in Inconel 718 Informed by Digital Image Correlation Coupled with 3D EBSD |
Author(s) |
Marie Charpagne, J.C. Stinville, Andrew T. Polonsky, McLean P. Echlin, Valery Valle, Tresa M. Pollock |
On-Site Speaker (Planned) |
Marie Charpagne |
Abstract Scope |
Understanding strain localization in polycrystalline metallic materials is of utmost interest for prediction of mechanical properties such as fatigue. In this study strain localization processes in relation to the 3D microstructure are investigated, in the structural alloy Inconel 718. High Resolution Digital Image Correlation strain measurements are accurately spatially merged with TriBeam 3D Electron backscatter diffraction data in order to determine the relationship between the grain structure and slip localization. Multi-modal data merging and advanced analysis algorithms are employed to statistically study plastic localization events as a function of the 3D microstructure, over large microstructural regions. Quantitative correlations between the amplitude of localization, activated slip systems and locations of thousands of individual slip bands and microstructure features (grain boundaries, annealing twin boundaries, triple junctions, quadruple points) will be discussed. Slip localization locations and active slip systems will be discussed in regards to theoretical predictions. |
Proceedings Inclusion? |
Planned: |
Keywords |
Characterization, Copper / Nickel / Cobalt, Mechanical Properties |