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Meeting Materials Science & Technology 2019
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Presentation Title A Model Study of Microstructure Evolution and Bi Diffusion in Sn-Bi Low Temperature Soldering Systems
Author(s) Yaohui Fan, John E. Blendell, Carol A. Handwerker
On-Site Speaker (Planned) Yaohui Fan
Abstract Scope A new low temperature interconnect technology based on Sn-Bi alloys is being considered for attaching Sn-Ag-Cu (SAC) solder BGAs to circuit boards at temperatures significantly lower than for homogeneous SAC joints. Microstructure development studies of reflow and annealing, including Bi diffusion and precipitation, are important in understanding mechanical reliability and failures paths in the resulting heterogeneous joints. Experiments in several SAC-SnBi geometries revealed that Bi concentration profiles deviate from local equilibrium expected from the phase diagram, with much higher local concentrations and lower volume fractions of liquid than expected during short-time high temperature anneals in the two-phase region. As annealing time increased and Sn grain coarsening occured, the compositions and fractions revert to the phase diagram, suggesting an “anti-Scheil” effect.
Proceedings Inclusion? Definite: At-meeting proceedings


A Model Study of Microstructure Evolution and Bi Diffusion in Sn-Bi Low Temperature Soldering Systems
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Fabrication of Stress Free Ni-Co Coatings Using Electroplating Method
Heated Mechanical Cycling as a Substitute for Thermal Cycling - A Preliminary Investigation for a New Failure Analysis Technique
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Interfacial Reactions in Co/Ag-Cu, Ni/Ag-Cu, Co/Ag-Sb and Ni/Ag-Sb Couples
Micro Interconnect Mechanical Stability in Cryogenic Temperature Environment
Micro Interconnect Shear and Creep Performance under Current Stressing
Microstructure Evolution in Cu and Ag Coated Cu Particle Sintering for Power Module Interconnection
Predicting Electromigration-mediated Damage in Interconnects Using Phase-Field Models
Stretchable Joint with Ag-PDMS for Wearable Electronics
Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration

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