|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Influence of Bi on Microstructure and Properties of Sn-Cu-Ni Based BGAs on Cu Metallization
||Sergey Belyakov, Christopher Gourlay, Takatoshi Nishimura, Keith Sweatman
|On-Site Speaker (Planned)
There has been significant interest in the addition of Bi to Pb-free solders as Bi has been demonstrated to lower melting temperature, to improve solder wetting performance and, more importantly, to improve mechanical properties of solder joints. In this study we investigate the influence of Bi additions on microstructure formation of Sn-Cu-Ni solders during reflow on Cu substrates as well as its evolution during storage at elevated temperatures. The focus is on (i) influence of Bi on nucleation and growth of tin in BGA joints and (ii) influence of Bi on solder microstructural stability during ageing. The second part of the talk will discuss the influence of Bi additions on thermal cycling and shear impact properties of BGA solder joints with a focus on their failure mechanisms.
||Planned: Supplemental Proceedings volume