| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Interfacial Reaction and Microstructure Variation in the Liquid Reaction of Sn-xAg-Cu Solders on Cu-yZn Substrates |
| Author(s) |
Chi-Yang Yu, Jenq-Gong Duh |
| On-Site Speaker (Planned) |
Chi-Yang Yu |
| Abstract Scope |
This study aims to investigate the liquid reaction of Sn-xAg-0.5Cu (x= 1 and 3 wt.%) solders on different Cu-yZn (y= 0, 15 and 30 wt.%) substrates at 250 oC for 30 s, 2 and 10 min, respectively. Cu and Zn atoms would dissolve from Cu-xZn substrates into molten solders during reflow. Under this condition, Cu6Sn5 was the dominating intermetallic compound (IMC) formed at the Sn-xAg-Cu/Cu-yZn interface. The composition of the Cu6Sn5 and other IMCs were altered with various solder joints and reflow time. Besides, IMCs growth rate was affected by the Zn concentration at the interface. In addition to interfacial reaction, the microstructure evolution and phase formation inside the Sn-3Ag-Cu and Sn-1Ag-Cu solders were correlated to the elemental distribution. Based on these results, the interaction between Ag content (x) in solder and Zn content (y) in substrate will be probed and discussed. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |