|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Energy Materials 2017: Materials in Clean Power
||Transient Liquid Phase Bonding of Ni-based-superalloy-H230 for Microchannel Heat Exchanger for Application in Supercritical CO2 Cycles
||Monica Kapoor, Omer Dogan, Brian Paul, Rajesh Saranam, Patrick McNuff
|On-Site Speaker (Planned)
The highly efficient supercritical CO2 (sCO2) cycles for power generation rely heavily on heat recuperation to increase efficiency. To this end, microchannel heat exchangers (µHX) are proposed to enhance heat transfer between heat source and sCO2 and also to reduce equipment size. Microchannel-architectures are formed by a lamination process wherein micro-sized-channels are formed in shims, which are then stacked and bonded to form a monolithic structure. Transient-liquid-phase-bonding (TLP) is one such joining techniques for µHX and was studied in Ni-based-superalloy-H230 for use in an HX operating at 700°C-800°C and 20-30 MPa pressure. Tensile testing of the stacks at 760°C indicated an yield strength of ~ 86% that of the bulk H230. sCO2 exposures of these stacks in an autoclave at 720°C and 25 MPa pressure for 500h – 1500 h were carried out. Microstructure characterization before and after corrosion was performed using x-ray diffraction, optical, scanning-electron and transmission-electron microscopy.
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