|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Corrosion Resistance of Surface Finishes for High Reliability Devices
||Tsan-Hsien Tseng, Albert T. Wu
|On-Site Speaker (Planned)
This study investigates the corrosion on different surface finishes for commercial automobile printed circuit broad (PCB). The surface finishes deposited on PCB were electroless nickel immersion gold (ENIG), immersion tin (ImSn), and electroless cobalt (EC). Bare copper sample (Cu) was used as the base line for comparison. All samples were exposed to sulfur dioxide (SO2) gas at 80 oC for different duration of times. The results of surface morphologies show that the corrosion products grow severely on bare Cu. More corrosion products were grown on ENIG and EC than on ImSn. However, the EDS results of Cu signal was detected only in the corrosion products on ImSn, ENIG, and bare Cu but no on EC. EC surface finish can inhibit the corrosion gas interacted with Cu substrate. A surface finish combined with ImSn and EC is developed to inhibit interaction between Cu and the SO2 and growth of corrosion products.
||Planned: Supplemental Proceedings volume