| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Interface Design of Lead-free Electronic Interconnects |
| Author(s) |
K.N. Subramanian, Deep Choudhuri, Andre Lee |
| On-Site Speaker (Planned) |
K.N. Subramanian |
| Abstract Scope |
Service reliability of lead-free electronic components is significantly affected by the thermal excursions encountered during service. Catastrophic crack that develops from such thermal excursions due to coefficient of thermal expansion mismatches are invariably at the interfaces, especially at the tin/tin grain boundaries or tin/(intermetallic-compound) interfaces, near the solder/substrate interface regions. Keying such interfaces to retard sliding of mating regions, or stitching such mating regions to prevent de-cohesion and dissipate stresses by promoting plastic deformation in tin grains, enhances the reliability of the lead-free electronic interconnects. Reinforcing lead-free solders containing significant amounts of tin with Nano-structured Polyhedral Oligomeric Silsesquioxane (POSS), consisting of Si-O cages with surface active radicals, provides such attributes to enhance the service reliability of interconnects made with them. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |