|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
||Effect of Ag Additives on Dissolution Kinetic of Cu Wire in Sn and Sn3.5Ag Solder
||YiXuan Lin, ChengYi Liu
|On-Site Speaker (Planned)
Firstly, Cu wires (25 micro meters) were mechanically embedded in the pure Sn solder. Then, the Cu wires/solder samples were annealed at three annealing temperatures (150, 180, 200 ░C). After annealing, the Cu wires/solder samples were cross sectioned and examined by SEM. With the SEM images on the cross sectioned Cu wires/Sn solder samples, the Cu-Sn intermetallic compound layers around the Cu wires were estimated and plotted with annealing time. Also, the consumed diameter of the Cu wires is calculated and plotted against the annealing. We repeat the above experimental processes but adding Ag additive in Sn solder (Sn3.5Ag). We found that the Ag additives would enhance the dissolution of Cu into the SnAg solder. In this talk, the effect of Ag additives on the dissolution behavior of Cu into Sn (or Sn3.5Ag) solder would be presented. Also, detail dissolution mechanism of the Cu wire into solder will be discussed.
||Planned: Supplemental Proceedings volume